Holophonix has debuted its 2.2 software version for all its immersive platforms – including hardware processors and the Holophonix Native app for macOS – plus a touring-ready hardware processor, called Holophonix Ultra. The Ultra reportedly offers higher performances for real-time spatialisation, with up to 512 inputs and outputs, an embedded touchscreen and redundant power supplies. It also introduces a new scalable licensing model.
The Holophonix Ultra features a redesigned chassis machined from aluminium blocks, integrating a tour-ready hardware configuration tailored for demanding setups. It comes with ultra-low audio latency and scalable I/O expandable up to 512 ins and outs, along with low noise and enhanced internal airflow, redundant power supplies and a built-in touchscreen on the front panel. This touchscreen provides instant access to crucial monitoring parameters, including IP addresses, network and performance status. The processor is also designed to be rack-mounted. The rear panel features Neutrik-housed connectors integrated into the aluminium chassis, including two powerCON mains connectors, three etherCON connectors for remote control and Dante connectivity, as well as Display-Port and USB 3.0 connectors for easy access while servicing.
The Holophonix 2.2 software update features a new design for the Inspector window for a better workflow and a new dock offering quick access to the main features for Holophonix users. This refreshed design is described as more live sound oriented, with its new logic and workflow deriving from the live mixing console universe. The update also features the ability to import and export CSV files from the overview window, a new Add menu for Sources and Speakers including pre-configured Dolby Atmos layouts and an improved audio engine.